Actual item. Sold as pictured.

Seiko Intruments (SII) OFL 12 Polisher/Polishing Machine.

The OFL12 Polisher is designed for mass volume production polishing with no periodic recalibration. It is ideal for high-speed analog and digital telecommunications needs where ultra-low loss and reflectivity are essential. The polishing process is accomplished in three stages: grinding, lapping and polishing.The OFL-12 can polish up to 12 connectors in four minutes. It accommodates a full range of industry-standard polishing styles and can process a wide variety of ferrule material. The OFL-12 offers mass production polishing without periodic recalibration and little need for repolishing. Weighing 50 pounds, the benchtop unit accommodates connector styles such as SC, FC, ST, D4 and APC. It accomplishes its polishing process in three stages: grinding, lapping and polishing. The resulting Super PC polish has a radius of 20 mm (13 mm typical). Fiber undercut is 0.1µm or less (0.05µm typical) and ferrule endface curvature offset is guaranteed at 50µm or less (18µm typical)